Assoc. Prof. Desmond Loke’s lab has developed scalable technologies for modulating Medium-doped Amorphous Glass (MAG). This breakthrough enables industry to use the extraordinary properties of amorphous glasses for next-generation digital memory devices for automotive, internet-of-things, and edge AI applications with quicker performance and enhanced energy efficiency, reliability, and downsizing ability.

He and his lab participated in the Techconnect World Innovation Challenge Competition and has received the 2024 Techconnect Innovation Award.

Title of work: Medium-doped Amorphous Glass (MAG) digital memory devices for next-generation edge AI and automotive applications
Conference name: Techconnect World Innovation Conference and Expo
Conference dates: 17-19 June 2024
Conference location: Washington, DC
Review panel: Experts from Boeing, Lockheed Martin, Noblereach, Techconnect ATI, USA

For more information on the TechConnect 2024 Innovation Awardees, please visit https://techconnectworld.com/World2024/participate/innovation/awards.html